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Rochester Electronics CAT809JTBI-GT3

CAT809 - 3-PIN MICROPROCESSOR PO
part number has RoHS
Manufacturer # :CAT809JTBI-GT3
Manufacturer :Rochester Electronics
Dasenic # :CAT809JTBI-GT3-DS
Customer # :
Description : CAT809 - 3-PIN MICROPROCESSOR PO
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
10+$ 0.1375$ 1.38
395+$ 0.1146$ 45.27
960+$ 0.0941$ 90.34
1485+$ 0.0911$ 135.28
2045+$ 0.0882$ 180.37
In Stock: 57384
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.1375
Total :$ 0.14
Delivery :
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Payment :
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CAT809JTBI-GT3 information

  • Rochester Electronics CAT809JTBI-GT3 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Microcontroller, Microprocessor, FPGA Modules
  • Product Status:Active
  • Operating Temperature:-
  • Package / Case:-
  • Supplier Device Package:-
  • Voltage - I/ O:-
  • Speed:-
  • Core Processor:-
  • Number of Cores/ Bus Width:-
  • Co- Processors/ D S P:-
  • R A M Controllers:-
  • Graphics Acceleration:-
  • Display & Interface Controllers:-
  • Ethernet:-
  • S A T A:-
  • U S B:-
  • Security Features:-
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
CAT809JTBI-GT3 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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