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  • Rochester Electronics BZX84-B27/DG/B3215

    DIODE ZENER 27V 250MW TO236AB
  • part number has RoHS
  • Mfr.Part # :BZX84-B27/DG/B3215
  • Manufacturer :Rochester Electronics
  • Dasenic # :BZX84-B27/DG/B3215-DS
  • Datasheet :pdf download BZX84-B27/DG/B3215 Datasheet
  • Description : DIODE ZENER 27V 250MW TO236AB
  • Package :-
  • Quantity :
    Unit Price : $ 0.0716Total : $ 0.07
  • Delivery Time :Ship Within 48 Hours
  • Shipping Origin :Shenzhen or Hong Kong Warehouse
  • Delivery :
    dhlupsfedex
  • Payment :
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In Stock: 1900
( MOQ : 1 PCS )
Pricing (USD) : * All prices are in USD
QuantityUnit PriceTotal
1 +$ 0.0716$ 0.07
25 +$ 0.0702$ 1.76
100 +$ 0.0673$ 6.73
500 +$ 0.0645$ 32.25
1000 +$ 0.0609$ 60.90

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Rochester Electronics BZX84-B27/DG/B3215 technical specifications, attributes, parameters.
Category:Discrete Semiconductor Devices/Diodes - Zener - Single
Product Status:Active
Tolerance:±2%
Operating Temperature:-65°C ~ 150°C (TJ)
Mounting Type:Surface Mount
Package / Case:TO-236-3, SC-59, SOT-23-3
Power - Max:250 mW
Supplier Device Package:SOT-23
Voltage - Forward ( Vf) ( Max) @ If:900 mV @ 10 mA
Current - Reverse Leakage @ Vr:50 nA @ 50 nA
Voltage - Zener ( Nom) ( Vz):27 V
Impedance ( Max) ( Zzt):80 Ohms
EU RoHS Status:Vendor omitted MSL Rating information
MSL Rating:1 (Unlimited, 30°C/85%RH)
REACH Status:REACH Unaffected
US ECCN:EAR99
HTS US:8541.10.0050
China RoHS Status:Green Symbol: Green and environmentally friendly product
BZX84-B27/DG/B3215 provided by Rochester Electronics

As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.

As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.

Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.

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