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Rochester Electronics BZB784-C3V6,115

NEXPERIA BZB784-C3V6 - ZENER DIO
part number has RoHS
Manufacturer # :BZB784-C3V6,115
Manufacturer :Rochester Electronics
Dasenic # :BZB784-C3V6,115-DS
Customer # :
Description : NEXPERIA BZB784-C3V6 - ZENER DIO
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 0.0248$ 0.02
25+$ 0.0243$ 0.61
100+$ 0.0233$ 2.33
500+$ 0.0223$ 11.15
1000+$ 0.0212$ 21.2
In Stock: 27820
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.0248
Total :$ 0.02
Delivery :
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Payment :
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BZB784-C3V6,115 information

  • Rochester Electronics BZB784-C3V6,115 technical specifications, attributes, parameters.
  • Category:Discrete Semiconductor Devices/Diodes - Zener - Arrays
  • Product Status:Active
  • Tolerance:±5%
  • Operating Temperature:-
  • Mounting Type:Surface Mount
  • Package / Case:SC-70, SOT-323
  • Power - Max:180 mW
  • Supplier Device Package:SOT-323
  • Configuration:1 Pair Common Anode
  • Voltage - Forward ( Vf) ( Max) @ If:900 mV @ 10 mA
  • Current - Reverse Leakage @ Vr:5 µA @ 1 V
  • Voltage - Zener ( Nom) ( Vz):3.6 V
  • Impedance ( Max) ( Zzt):90 Ohms
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8541.10.0050
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
BZB784-C3V6,115 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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