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Rochester Electronics BYC15-600P127

HYPERFAST RECTIFIER DIODE TO 22
part number has RoHS
Manufacturer # :BYC15-600P127
Manufacturer :Rochester Electronics
Dasenic # :BYC15-600P127-DS
Customer # :
Description : HYPERFAST RECTIFIER DIODE TO 22
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
10+$ 0.5616$ 5.62
573+$ 0.4680$ 268.16
In Stock: 5070
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.5616
Total :$ 0.56
Delivery :
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Payment :
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BYC15-600P127 information

  • Rochester Electronics BYC15-600P127 technical specifications, attributes, parameters.
  • Category:Discrete Semiconductor Devices/Diodes - Rectifiers - Single
  • Product Status:Active
  • Mounting Type:Through Hole
  • Package / Case:TO-220-2
  • Supplier Device Package:TO-220AC
  • Speed:Fast Recovery =< 500ns, > 200mA (Io)
  • Diode Type:Standard
  • Current - Average Rectified ( Io):-
  • Voltage - Forward ( Vf) ( Max) @ If:3.2 V @ 15 A
  • Current - Reverse Leakage @ Vr:10 µA @ 600 V
  • Capacitance @ Vr, F:-
  • Voltage - D C Reverse ( Vr) ( Max):600 V
  • Reverse Recovery Time (trr):18 ns
  • Operating Temperature - Junction:175°C (Max)
  • EU RoHS Status:RoHS Compliant
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • HTS US:8541.10.0080
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
BYC15-600P127 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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