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Rochester Electronics BUF05704AIPWPG4

IC 4CH GAM CORRECT BUFF 14HTSSOP
part number has RoHS
Manufacturer # :BUF05704AIPWPG4
Manufacturer :Rochester Electronics
Dasenic # :BUF05704AIPWPG4-DS
Customer # :
Description : IC 4CH GAM CORRECT BUFF 14HTSSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 0.7065$ 0.71
25+$ 0.6924$ 17.31
100+$ 0.6641$ 66.41
500+$ 0.6359$ 317.95
1000+$ 0.6006$ 600.6
In Stock: 1562
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.7065
Total :$ 0.71
Delivery :
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BUF05704AIPWPG4 information

  • Rochester Electronics BUF05704AIPWPG4 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Linear - Amplifiers - Video Amps and Modules
  • Product Status:Active
  • Mounting Type:Surface Mount
  • Package / Case:14-TSSOP (0.173", 4.40mm Width) Exposed Pad
  • Current - Supply:5 mA
  • Output Type:Rail-to-Rail
  • Supplier Device Package:14-HTSSOP
  • Number of Circuits:4
  • -3db Bandwidth:1 MHz
  • Current - Output / Channel:-
  • Slew Rate:1.6V/µs
  • Voltage - Supply, Single/ Dual (±):4.5V ~ 18V
  • Applications:TFT-LCD Panels: Gamma Buffer, VCOM Driver
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
BUF05704AIPWPG4 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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