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1 : $0.5742
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Rochester Electronics BSP78E6327
POWER SWITCH SMART LOW
Manufacturer # :BSP78E6327
Manufacturer :Rochester Electronics
Dasenic # :BSP78E6327-DS
Datasheet :
BSP78E6327 Datasheet
BSP78E6327 DatasheetCustomer # :
Description : POWER SWITCH SMART LOW
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 0.5742 | $ 0.57 |
| 200+ | $ 0.2234 | $ 44.68 |
| 500+ | $ 0.2148 | $ 107.4 |
| 1000+ | $ 0.2105 | $ 210.5 |
In Stock: 1740
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.5742
Total :$ 0.57
Delivery :
Payment :
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BSP78E6327 information
Rochester Electronics BSP78E6327 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Power Distribution Switches, Load Drivers
- Product Status:Active
- Operating Temperature:-
- Features:-
- Mounting Type:-
- Package / Case:-
- Input Type:-
- Output Type:-
- Interface:-
- Supplier Device Package:-
- Ratio - Input: Output:-
- Voltage - Supply ( Vcc/ Vdd):-
- Number of Outputs:-
- Fault Protection:-
- Output Configuration:-
- Rds On ( Typ):-
- Voltage - Load:-
- Current - Output ( Max):-
- Switch Type:-
- EU RoHS Status:RoHS Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH is not affected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
BSP78E6327 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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