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Rochester Electronics BSM35GP120GBOSA1

IGBT MOD 1200V 45A 230W
part number has RoHS
Manufacturer # :BSM35GP120GBOSA1
Manufacturer :Rochester Electronics
Dasenic # :BSM35GP120GBOSA1-DS
Customer # :
Description : IGBT MOD 1200V 45A 230W
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
In Stock: 2709
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0
Total :$ 0.00
Delivery :
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BSM35GP120GBOSA1 information

  • Rochester Electronics BSM35GP120GBOSA1 technical specifications, attributes, parameters.
  • Category:Discrete Semiconductor Devices/Transistors - IGBTs - Modules
  • Product Status:Last Time Buy
  • Operating Temperature:-40°C ~ 125°C
  • Mounting Type:Chassis Mount
  • Package / Case:Module
  • Power - Max:230 W
  • Supplier Device Package:Module
  • Configuration:Full Bridge
  • Input:Three Phase Bridge Rectifier
  • Current - Collector ( Ic) ( Max):45 A
  • Voltage - Collector Emitter Breakdown ( Max):1200 V
  • Current - Collector Cutoff ( Max):500 µA
  • I G B T Type:-
  • Vce(on) ( Max) @ Vge, Ic:2.85V @ 15V, 35A
  • Input Capacitance ( Cies) @ Vce:1.5 nF @ 25 V
  • N T C Thermistor:Yes
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
BSM35GP120GBOSA1 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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