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Rochester Electronics BQ77910ADBT
IC BATT LI-ION 4-10C 38TSSOP
Manufacturer # :BQ77910ADBT
Manufacturer :Rochester Electronics
Dasenic # :BQ77910ADBT-DS
Datasheet :
BQ77910ADBT Datasheet
BQ77910ADBT DatasheetCustomer # :
Description : IC BATT LI-ION 4-10C 38TSSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 15+ | $ 3.0528 | $ 45.79 |
| 36+ | $ 2.5047 | $ 90.17 |
| 56+ | $ 2.4264 | $ 135.88 |
| 77+ | $ 2.3481 | $ 180.8 |
| 100+ | $ 2.2698 | $ 226.98 |
In Stock: 33144
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 3.0528
Total :$ 3.05
Delivery :
Payment :
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BQ77910ADBT information
Rochester Electronics BQ77910ADBT technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Battery Management
- Product Status:Not For New Designs
- Operating Temperature:-25°C ~ 85°C (TA)
- Mounting Type:Surface Mount
- Package / Case:38-TFSOP (0.173", 4.40mm Width)
- Battery Chemistry:Lithium Ion/Polymer
- Number of Cells:4 ~ 10
- Interface:I²C
- Supplier Device Package:38-TSSOP
- Fault Protection:Over Current, Over Temperature, Over/Under Voltage, Short Circuit
- Function:Multi-Function Controller
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Green Symbol: Green and environmentally friendly product
BQ77910ADBT provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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