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1 : $5.9130
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Rochester Electronics BQ7693001DBT
IC BATT MON MULTI 6-10C 30TSSOP
Manufacturer # :BQ7693001DBT
Manufacturer :Rochester Electronics
Dasenic # :BQ7693001DBT-DS
Datasheet :
BQ7693001DBT Datasheet
BQ7693001DBT DatasheetCustomer # :
Description : IC BATT MON MULTI 6-10C 30TSSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 5.9130 | $ 5.91 |
| 10+ | $ 5.3136 | $ 53.14 |
| 60+ | $ 5.0232 | $ 301.39 |
| 120+ | $ 4.3534 | $ 522.41 |
| 300+ | $ 4.1301 | $ 1239.03 |
In Stock: 1731
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 5.913
Total :$ 5.91
Delivery :
Payment :
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BQ7693001DBT information
Rochester Electronics BQ7693001DBT technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Battery Management
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Surface Mount
- Package / Case:30-TFSOP (0.173", 4.40mm Width)
- Battery Chemistry:Multi-Chemistry
- Number of Cells:6 ~ 10
- Interface:I²C
- Supplier Device Package:30-TSSOP
- Fault Protection:Over Current, Over/Under Voltage, Short Circuit
- Function:Battery Monitor
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:2 (1 Year,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
BQ7693001DBT provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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