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  • Rochester Electronics BQ4832YMA-85

    IC RTC CLK/CALENDAR PAR 32-DIP
  • part number has RoHS
  • Mfr.Part # :BQ4832YMA-85
  • Manufacturer :Rochester Electronics
  • Dasenic # :BQ4832YMA-85-DS
  • Datasheet :pdf download BQ4832YMA-85 Datasheet
  • Description : IC RTC CLK/CALENDAR PAR 32-DIP
  • Package :-
  • Quantity :
    Unit Price : $ 37.026Total : $ 37.03
  • Delivery Time :Ship Within 48 Hours
  • Shipping Origin :Shenzhen or Hong Kong Warehouse
  • Delivery :
    dhlupsfedex
  • Payment :
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In Stock: 1821
( MOQ : 1 PCS )
Pricing (USD) : * All prices are in USD
QuantityUnit PriceTotal
1 +$ 37.0260$ 37.03
25 +$ 36.2880$ 907.20
100 +$ 34.8030$ 3480.30
500 +$ 33.3270$ 16663.50
1000 +$ 31.4730$ 31473.00

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Rochester Electronics BQ4832YMA-85 technical specifications, attributes, parameters.
Category:Integrated Circuits (ICs)/Real Time Clocks
Product Status:Obsolete
Operating Temperature:0°C ~ 70°C
Features:Alarm, Supervisor, Watchdog Timer
Mounting Type:Through Hole
Package / Case:32-DIP Module (0.610", 15.49mm)
Type:Clock/Calendar
Interface:Parallel
Supplier Device Package:32-DIP Module (18.42x42.8)
Memory Size:-
Voltage - Supply:4.5V ~ 5.5V
Time Format:HH:MM:SS:hh (24 hr)
Date Format:YY-MM-DD-dd
Voltage - Supply, Battery:-
Current - Timekeeping ( Max):4mA @ 4.5 V ~ 5.5 V
EU RoHS Status:RoHS Compliant
REACH Status:Vendor is not defined
US ECCN:Provided as per user requirements
China RoHS Status:Green Symbol: Green and environmentally friendly product
BQ4832YMA-85 provided by Rochester Electronics

As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.

As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.

Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.

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