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1 : $6.6132
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Rochester Electronics BQ33100PW
IC BATT SUPERCAP 2-5C 24TSSOP
Manufacturer # :BQ33100PW
Manufacturer :Rochester Electronics
Dasenic # :BQ33100PW-DS
Datasheet :
BQ33100PW Datasheet
BQ33100PW DatasheetCustomer # :
Description : IC BATT SUPERCAP 2-5C 24TSSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 7+ | $ 6.6132 | $ 46.29 |
| 17+ | $ 5.4261 | $ 92.24 |
| 26+ | $ 5.2569 | $ 136.68 |
| 36+ | $ 5.0877 | $ 183.16 |
| 46+ | $ 4.9176 | $ 226.21 |
In Stock: 28873
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 6.6132
Total :$ 6.61
Delivery :
Payment :
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BQ33100PW information
Rochester Electronics BQ33100PW technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Battery Management
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Surface Mount
- Package / Case:24-TSSOP (0.173", 4.40mm Width)
- Battery Chemistry:Supercapacitor
- Number of Cells:2 ~ 5
- Interface:SMBus
- Supplier Device Package:24-TSSOP
- Fault Protection:Over Current, Over Temperature, Over/Under Voltage, Short Circuit
- Function:Multi-Function Controller
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:2 (1 Year,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
BQ33100PW provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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