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  • Rochester Electronics BQ3287MT-SB2

    IC RTC CLK/CALENDAR PAR 24-DIP
  • part number has RoHS
  • Mfr.Part # :BQ3287MT-SB2
  • Manufacturer :Rochester Electronics
  • Dasenic # :BQ3287MT-SB2-DS
  • Datasheet :pdf download BQ3287MT-SB2 Datasheet
  • Description : IC RTC CLK/CALENDAR PAR 24-DIP
  • Package :-
  • Quantity :
    Unit Price : $ 34.614Total : $ 34.61
  • Delivery Time :Ship Within 48 Hours
  • Shipping Origin :Shenzhen or Hong Kong Warehouse
  • Delivery :
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  • Payment :
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In Stock: 1603
( MOQ : 1 PCS )
Pricing (USD) : * All prices are in USD
QuantityUnit PriceTotal
1 +$ 34.6140$ 34.61
100 +$ 25.9650$ 2596.50
1000 +$ 22.5000$ 22500.00

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Rochester Electronics BQ3287MT-SB2 technical specifications, attributes, parameters.
Category:Integrated Circuits (ICs)/Real Time Clocks
Product Status:Obsolete
Operating Temperature:-
Features:Alarm, Daylight Savings, Leap Year, NVSRAM, Square Wave Output
Mounting Type:Through Hole
Package / Case:24-DIP Module (0.61", 15.49mm)
Type:Clock/Calendar
Interface:Parallel
Supplier Device Package:24-DIP Module
Memory Size:114B
Voltage - Supply:4.5V ~ 5.5V
Time Format:HH:MM:SS (12/24 hr)
Date Format:YY-MM-DD-dd
Voltage - Supply, Battery:-
Current - Timekeeping ( Max):-
EU RoHS Status:ROHS3 Compliant
MSL Rating:1 (Unlimited, 30°C/85%RH)
REACH Status:REACH Unaffected
US ECCN:EAR99
HTS US:8542.39.0001
China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
BQ3287MT-SB2 provided by Rochester Electronics

As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.

As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.

Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.

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