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1 : $2.8350
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Rochester Electronics BQ2202SN-N
IC BATT CHG PWR SUP CIRC ADJ
Manufacturer # :BQ2202SN-N
Manufacturer :Rochester Electronics
Dasenic # :BQ2202SN-N-DS
Datasheet :
BQ2202SN-N Datasheet
BQ2202SN-N DatasheetCustomer # :
Description : IC BATT CHG PWR SUP CIRC ADJ
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 2.8350 | $ 2.84 |
| 25+ | $ 2.7810 | $ 69.53 |
| 100+ | $ 2.6640 | $ 266.4 |
| 500+ | $ 2.5560 | $ 1278 |
| 1000+ | $ 2.4120 | $ 2412 |
In Stock: 7065
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.835
Total :$ 2.83
Delivery :
Payment :
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BQ2202SN-N information
Rochester Electronics BQ2202SN-N technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Battery Chargers
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:-
- Battery Chemistry:Lithium Ion/Polymer
- Number of Cells:1
- Charge Current - Max:6mA
- Interface:-
- Supplier Device Package:-
- Fault Protection:Over Voltage
- Current - Charging:Constant
- Programmable Features:-
- Battery Pack Voltage:3V
- Voltage - Supply ( Max):5.5V
- EU RoHS Status:ROHS3 Compliant
- US ECCN:EAR99
- HTS US:8542.39.0001
- REACH Status:Vendor is not defined
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
BQ2202SN-N provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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