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Rochester Electronics BQ2057TSNTR

IC BATT CHG LI-ION 1-2CELL
part number has RoHS
Manufacturer # :BQ2057TSNTR
Manufacturer :Rochester Electronics
Dasenic # :BQ2057TSNTR-DS
Customer # :
Description : IC BATT CHG LI-ION 1-2CELL
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 0.4973$ 0.5
25+$ 0.4874$ 12.19
100+$ 0.4674$ 46.74
500+$ 0.4475$ 223.75
1000+$ 0.4226$ 422.6
In Stock: 4668
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.4973
Total :$ 0.50
Delivery :
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Payment :
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BQ2057TSNTR information

  • Rochester Electronics BQ2057TSNTR technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/PMIC - Battery Chargers
  • Product Status:Obsolete
  • Operating Temperature:-20°C ~ 70°C
  • Mounting Type:Surface Mount
  • Package / Case:-
  • Battery Chemistry:Lithium Ion/Polymer
  • Number of Cells:1 ~ 2
  • Charge Current - Max:4mA
  • Interface:-
  • Supplier Device Package:-
  • Fault Protection:Over Current, Over Temperature
  • Current - Charging:Constant - Programmable
  • Programmable Features:Current
  • Battery Pack Voltage:4.1V
  • Voltage - Supply ( Max):15V
  • EU RoHS Status:RoHS Compliant
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • REACH Status:Vendor is not defined
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
BQ2057TSNTR provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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