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Rochester Electronics BQ2002GSN

IC BATT CONTRL MULTI-CHEM 8SOIC
part number has RoHS
Manufacturer # :BQ2002GSN
Manufacturer :Rochester Electronics
Dasenic # :BQ2002GSN-DS
Customer # :
Description : IC BATT CONTRL MULTI-CHEM 8SOIC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 1.2870$ 1.29
25+$ 1.2600$ 31.5
100+$ 1.2060$ 120.6
500+$ 1.1610$ 580.5
1000+$ 1.0980$ 1098
In Stock: 22841
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.287
Total :$ 1.29
Delivery :
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Payment :
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BQ2002GSN information

  • Rochester Electronics BQ2002GSN technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/PMIC - Battery Chargers
  • Product Status:Active
  • Operating Temperature:0°C ~ 70°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:8-SOIC (0.154", 3.90mm Width)
  • Battery Chemistry:Multi-Chemistry
  • Number of Cells:-
  • Charge Current - Max:-
  • Interface:-
  • Supplier Device Package:8-SOIC
  • Fault Protection:-
  • Current - Charging:Constant, Pulsed
  • Programmable Features:Voltage
  • Battery Pack Voltage:2V
  • Voltage - Supply ( Max):6V
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
BQ2002GSN provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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