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Rochester Electronics BGS13SL9E6327

GENERAL PURPOSE SWITCH SP3T
part number has RoHS
Manufacturer # :BGS13SL9E6327
Manufacturer :Rochester Electronics
Dasenic # :BGS13SL9E6327-DS
Customer # :
Description : GENERAL PURPOSE SWITCH SP3T
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
10+$ 0.7680$ 7.68
944+$ 0.6400$ 604.16
In Stock: 8255
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.768
Total :$ 0.77
Delivery :
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Payment :
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BGS13SL9E6327 information

  • Rochester Electronics BGS13SL9E6327 technical specifications, attributes, parameters.
  • Category:RF and Wireless/RF Switches
  • Product Status:Active
  • Operating Temperature:-30°C ~ 85°C
  • Features:-
  • Package / Case:9-XFLGA
  • Impedance:50Ohm
  • Frequency Range:100MHz ~ 3GHz
  • Supplier Device Package:TSLP-9-3
  • Voltage - Supply:2.3V ~ 3.6V
  • Circuit:SP3T
  • Topology:-
  • Insertion Loss:0.54dB
  • Isolation:22dB
  • P1d B:-
  • R F Type:Bluetooth, WLAN
  • Test Frequency:2.7GHz
  • I I P3:-
  • EU RoHS Status:RoHS Compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
BGS13SL9E6327 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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