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Rochester Electronics BCV26E6327

TRANS PNP DARL 30V 0.5A SOT23
part number has RoHS
Manufacturer # :BCV26E6327
Manufacturer :Rochester Electronics
Dasenic # :BCV26E6327-DS
Customer # :
Description : TRANS PNP DARL 30V 0.5A SOT23
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
In Stock: 917
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0
Total :$ 0.00
Delivery :
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BCV26E6327 information

  • Rochester Electronics BCV26E6327 technical specifications, attributes, parameters.
  • Category:Discrete Semiconductor Devices/Transistors - Bipolar (BJT) - Single
  • Product Status:Active
  • Operating Temperature:150°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:TO-236-3, SC-59, SOT-23-3
  • Power - Max:360 mW
  • Supplier Device Package:PG-SOT23
  • Transistor Type:PNP - Darlington
  • Current - Collector ( Ic) ( Max):500 mA
  • Voltage - Collector Emitter Breakdown ( Max):30 V
  • Vce Saturation ( Max) @ Ib, Ic:1V @ 100µA, 100mA
  • Current - Collector Cutoff ( Max):100nA (ICBO)
  • D C Current Gain (h F E) ( Min) @ Ic, Vce:20000 @ 100mA, 5V
  • Frequency - Transition:200MHz
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8541.21.0075
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
BCV26E6327 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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