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Rochester Electronics BCR3KM-12LB1AR#B00

INSULATED TRIAC, 600V, 3A
part number has RoHS
Manufacturer # :BCR3KM-12LB1AR#B00
Manufacturer :Rochester Electronics
Dasenic # :BCR3KM-12LB1AR#B00-DS
Customer # :
Description : INSULATED TRIAC, 600V, 3A
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 6.4427$ 6.44
25+$ 6.3140$ 157.85
100+$ 6.0559$ 605.59
500+$ 5.7986$ 2899.3
1000+$ 5.4762$ 5476.2
In Stock: 23014
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 6.4427
Total :$ 6.44
Delivery :
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Payment :
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BCR3KM-12LB1AR#B00 information

  • Rochester Electronics BCR3KM-12LB1AR#B00 technical specifications, attributes, parameters.
  • Category:Discrete Semiconductor Devices/Thyristors - TRIACs
  • Product Status:Active
  • Operating Temperature:-
  • Mounting Type:-
  • Package / Case:-
  • Supplier Device Package:-
  • Configuration:-
  • Current - Hold ( Ih) ( Max):-
  • Voltage - Off State:-
  • Current - On State ( It ( R M S)) ( Max):-
  • Voltage - Gate Trigger ( Vgt) ( Max):-
  • Current - Gate Trigger ( Igt) ( Max):-
  • Current - Non Rep. Surge 50, 60 Hz ( Itsm):-
  • Triac Type:-
  • EU RoHS Status:RoHS Compliant
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • HTS US:8541.30.0080
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
BCR3KM-12LB1AR#B00 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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