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Rochester Electronics BCR25KR-12LB#B00
BCR25KR-12LB - MEDIUM POWER TRIA
Manufacturer # :BCR25KR-12LB#B00
Manufacturer :Rochester Electronics
Dasenic # :BCR25KR-12LB#B00-DS
Datasheet :
BCR25KR-12LB#B00 Datasheet
BCR25KR-12LB#B00 DatasheetCustomer # :
Description : BCR25KR-12LB - MEDIUM POWER TRIA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 55+ | $ 4.9500 | $ 272.25 |
In Stock: 4374
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 4.95
Total :$ 4.95
Delivery :
Payment :
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BCR25KR-12LB#B00 information
Rochester Electronics BCR25KR-12LB#B00 technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Thyristors - TRIACs
- Product Status:Obsolete
- Operating Temperature:150°C (TJ)
- Mounting Type:Through Hole
- Package / Case:TO-220-3 Full Pack
- Supplier Device Package:TO-220FN
- Configuration:Single
- Current - Hold ( Ih) ( Max):-
- Voltage - Off State:600 V
- Current - On State ( It ( R M S)) ( Max):25 A
- Voltage - Gate Trigger ( Vgt) ( Max):-
- Current - Gate Trigger ( Igt) ( Max):50 mA
- Current - Non Rep. Surge 50, 60 Hz ( Itsm):250A @ 60Hz
- Triac Type:Standard
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
BCR25KR-12LB#B00 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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