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Rochester Electronics BCR 129 E6327
Manufacturer # :BCR 129 E6327
Manufacturer :Rochester Electronics
Dasenic # :BCR 129 E6327-DS
Datasheet : BCR 129 E6327 Datasheet
Customer # :
Description : BIPOLAR DIGITAL TRANSISTOR
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 2902
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.0806
Total :$ 0.08
Delivery :
Payment :
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BCR 129 E6327 information
Rochester Electronics BCR 129 E6327 technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Transistors - Bipolar (BJT) - Single, Pre-Biased
- Product Status:Active
- Mounting Type:Surface Mount
- Package / Case:TO-236-3, SC-59, SOT-23-3
- Power - Max:200 mW
- Supplier Device Package:PG-SOT23-3-11
- Transistor Type:NPN - Pre-Biased
- Current - Collector ( Ic) ( Max):100 mA
- Voltage - Collector Emitter Breakdown ( Max):50 V
- Vce Saturation ( Max) @ Ib, Ic:300mV @ 500µA, 10mA
- Current - Collector Cutoff ( Max):100nA (ICBO)
- D C Current Gain (h F E) ( Min) @ Ic, Vce:120 @ 5mA, 5V
- Frequency - Transition:150 MHz
- Resistor - Base ( R1):10 kOhms
- Resistor - Emitter Base ( R2):-
- EU RoHS Status:Vendor omitted MSL Rating information
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8541.21.0075
- China RoHS Status:Green Symbol: Green and environmentally friendly product
BCR 129 E6327 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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