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1 : $10.6200
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Rochester Electronics BCM20746A0KFBGT
IOT BLUETOOTH 802.15.4
Manufacturer # :BCM20746A0KFBGT
Manufacturer :Rochester Electronics
Dasenic # :BCM20746A0KFBGT-DS
Datasheet :
BCM20746A0KFBGT Datasheet
BCM20746A0KFBGT DatasheetCustomer # :
Description : IOT BLUETOOTH 802.15.4
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 10.6200 | $ 10.62 |
| 25+ | $ 10.4040 | $ 260.1 |
| 100+ | $ 9.9810 | $ 998.1 |
| 500+ | $ 9.5580 | $ 4779 |
| 1000+ | $ 9.0270 | $ 9027 |
In Stock: 21600
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 10.62
Total :$ 10.62
Delivery :
Payment :
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BCM20746A0KFBGT information
Rochester Electronics BCM20746A0KFBGT technical specifications, attributes, parameters.
- Category:RF and Wireless/RF Transceiver ICs
- Product Status:Active
- Operating Temperature:-
- Mounting Type:Surface Mount
- Package / Case:64-VFBGA
- Frequency:-
- Type:-
- Sensitivity:-
- Supplier Device Package:64-FBGA (7x7)
- Data Rate ( Max):-
- Memory Size:-
- Voltage - Supply:-
- Power - Output:-
- Protocol:-
- Serial Interfaces:-
- R F Family/ Standard:-
- Current - Receiving:-
- Modulation:-
- G P I O:-
- Current - Transmitting:-
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
BCM20746A0KFBGT provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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