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Rochester Electronics BBY53-03WE6327HTSA1
DIODE TUNING 6V 20MA SOD-323
Manufacturer # :BBY53-03WE6327HTSA1
Manufacturer :Rochester Electronics
Dasenic # :BBY53-03WE6327HTSA1-DS
Datasheet :
BBY53-03WE6327HTSA1 Datasheet
BBY53-03WE6327HTSA1 DatasheetCustomer # :
Description : DIODE TUNING 6V 20MA SOD-323
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 10+ | $ 0.0130 | $ 0.13 |
| 500+ | $ 0.0108 | $ 5.4 |
| 2100+ | $ 0.0135 | $ 28.35 |
In Stock: 10019
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.013
Total :$ 0.01
Delivery :
Payment :
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BBY53-03WE6327HTSA1 information
Rochester Electronics BBY53-03WE6327HTSA1 technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Diodes - Variable Capacitance (Varicaps, Varactors)
- Product Status:Active
- Operating Temperature:-55°C ~ 125°C
- Mounting Type:Surface Mount
- Package / Case:SC-76, SOD-323
- Supplier Device Package:PG-SOD323-2
- Diode Type:Single
- Voltage - Peak Reverse ( Max):6 V
- Capacitance @ Vr, F:3.1pF @ 3V, 1MHz
- Capacitance Ratio:2.6
- Capacitance Ratio Condition:C1/C3
- Q @ Vr, F:-
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- US ECCN:EAR99
- HTS US:8541.10.0070
- REACH Status:REACH is not affected
- China RoHS Status:Green Symbol: Green and environmentally friendly product
BBY53-03WE6327HTSA1 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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