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1 : $0.0375
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Rochester Electronics BB804SF2E6327
VARIABLE CAPACITANCE DIODE
Manufacturer # :BB804SF2E6327
Manufacturer :Rochester Electronics
Dasenic # :BB804SF2E6327-DS
Datasheet :
BB804SF2E6327 Datasheet
BB804SF2E6327 DatasheetCustomer # :
Description : VARIABLE CAPACITANCE DIODE
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 0.0375 | $ 0.04 |
| 25+ | $ 0.0368 | $ 0.92 |
| 100+ | $ 0.0353 | $ 3.53 |
| 500+ | $ 0.0338 | $ 16.9 |
| 1000+ | $ 0.0319 | $ 31.9 |
In Stock: 12951
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.0375
Total :$ 0.04
Delivery :
Payment :
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BB804SF2E6327 information
Rochester Electronics BB804SF2E6327 technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Diodes - Variable Capacitance (Varicaps, Varactors)
- Product Status:Active
- Operating Temperature:-55°C ~ 125°C
- Mounting Type:Surface Mount
- Package / Case:TO-236-3, SC-59, SOT-23-3
- Supplier Device Package:PG-SOT23
- Diode Type:1 Pair Common Cathode
- Voltage - Peak Reverse ( Max):18 V
- Capacitance @ Vr, F:47.5pF @ 2V, 1MHz
- Capacitance Ratio:1.71
- Capacitance Ratio Condition:C2/C8
- Q @ Vr, F:200 @ 2V, 100MHz
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
BB804SF2E6327 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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