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Rochester Electronics BAW101E6433

BAW101 - HIGH VOLTAGE DOUBLE DIO
part number has RoHS
Manufacturer # :BAW101E6433
Manufacturer :Rochester Electronics
Dasenic # :BAW101E6433-DS
Customer # :
Description : BAW101 - HIGH VOLTAGE DOUBLE DIO
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
10+$ 0.1620$ 1.62
2420+$ 0.1080$ 261.36
In Stock: 24000
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.162
Total :$ 0.16
Delivery :
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Payment :
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BAW101E6433 information

  • Rochester Electronics BAW101E6433 technical specifications, attributes, parameters.
  • Category:Discrete Semiconductor Devices/Diodes - Rectifiers - Arrays
  • Product Status:Active
  • Mounting Type:Surface Mount
  • Package / Case:TO-253-4, TO-253AA
  • Supplier Device Package:SOT143 (SC-61)
  • Speed:Standard Recovery >500ns, > 200mA (Io)
  • Diode Type:Standard
  • Voltage - Forward ( Vf) ( Max) @ If:1.3 V @ 100 mA
  • Current - Reverse Leakage @ Vr:150 nA @ 250 V
  • Diode Configuration:2 Independent
  • Voltage - D C Reverse ( Vr) ( Max):300 V
  • Current - Average Rectified ( Io) (per Diode):250mA (DC)
  • Reverse Recovery Time (trr):1 µs
  • Operating Temperature - Junction:150°C
  • US ECCN:EAR99
  • HTS US:8541.10.0070
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
BAW101E6433 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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