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1 : $0.1080
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Rochester Electronics BAW101E6327
RECTIFIER DIODE
Manufacturer # :BAW101E6327
Manufacturer :Rochester Electronics
Dasenic # :BAW101E6327-DS
Datasheet :
BAW101E6327 Datasheet
BAW101E6327 DatasheetCustomer # :
Description : RECTIFIER DIODE
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 10+ | $ 0.1620 | $ 1.62 |
| 2420+ | $ 0.1080 | $ 261.36 |
In Stock: 22020
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.162
Total :$ 0.16
Delivery :
Payment :
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BAW101E6327 information
Rochester Electronics BAW101E6327 technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Diodes - Rectifiers - Arrays
- Product Status:Active
- Mounting Type:Surface Mount
- Package / Case:TO-253-4, TO-253AA
- Supplier Device Package:PG-SOT-143-3D
- Speed:Standard Recovery >500ns, > 200mA (Io)
- Diode Type:Standard
- Voltage - Forward ( Vf) ( Max) @ If:1.3 V @ 100 mA
- Current - Reverse Leakage @ Vr:150 nA @ 250 V
- Diode Configuration:2 Independent
- Voltage - D C Reverse ( Vr) ( Max):300 V
- Current - Average Rectified ( Io) (per Diode):250mA (DC)
- Reverse Recovery Time (trr):1 µs
- Operating Temperature - Junction:150°C (Max)
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
BAW101E6327 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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