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Rochester Electronics BAT64-06B5000
SCHOTTKY DIODE
Manufacturer # :BAT64-06B5000
Manufacturer :Rochester Electronics
Dasenic # :BAT64-06B5000-DS
Datasheet :
BAT64-06B5000 Datasheet
BAT64-06B5000 DatasheetCustomer # :
Description : SCHOTTKY DIODE
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 0.0250 | $ 0.03 |
| 25+ | $ 0.0245 | $ 0.61 |
| 100+ | $ 0.0235 | $ 2.35 |
| 500+ | $ 0.0225 | $ 11.25 |
| 1000+ | $ 0.0212 | $ 21.2 |
In Stock: 6696
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.025
Total :$ 0.03
Delivery :
Payment :
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BAT64-06B5000 information
Rochester Electronics BAT64-06B5000 technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Diodes - Rectifiers - Arrays
- Product Status:Active
- Mounting Type:-
- Package / Case:-
- Supplier Device Package:-
- Speed:-
- Diode Type:-
- Voltage - Forward ( Vf) ( Max) @ If:-
- Current - Reverse Leakage @ Vr:-
- Diode Configuration:-
- Voltage - D C Reverse ( Vr) ( Max):-
- Current - Average Rectified ( Io) (per Diode):-
- Reverse Recovery Time (trr):-
- Operating Temperature - Junction:-
- EU RoHS Status:RoHS Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH is not affected
- US ECCN:EAR99
- HTS US:8541.10.0070
- China RoHS Status:Green Symbol: Green and environmentally friendly product
BAT64-06B5000 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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