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1 : $309.9000
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Rochester Electronics BAS7004E6327
SCHOTTKY DIODE
Manufacturer # :BAS7004E6327
Manufacturer :Rochester Electronics
Dasenic # :BAS7004E6327-DS
Datasheet :
BAS7004E6327 Datasheet
BAS7004E6327 DatasheetCustomer # :
Description : SCHOTTKY DIODE
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 309.9000 | $ 309.9 |
| 5+ | $ 288.6600 | $ 1443.3 |
In Stock: 2806
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 309.9
Total :$ 309.90
Delivery :
Payment :
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BAS7004E6327 information
Rochester Electronics BAS7004E6327 technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Diodes - Rectifiers - Arrays
- Product Status:Active
- Mounting Type:Surface Mount
- Package / Case:TO-236-3, SC-59, SOT-23-3
- Supplier Device Package:PG-SOT23
- Speed:Small Signal =< 200mA (Io), Any Speed
- Diode Type:Schottky
- Voltage - Forward ( Vf) ( Max) @ If:1 V @ 15 mA
- Current - Reverse Leakage @ Vr:100 nA @ 50 V
- Diode Configuration:1 Pair Series Connection
- Voltage - D C Reverse ( Vr) ( Max):70 V
- Current - Average Rectified ( Io) (per Diode):70mA (DC)
- Reverse Recovery Time (trr):100 ps
- Operating Temperature - Junction:150°C (Max)
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
BAS7004E6327 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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