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Rochester Electronics B4860NXN7QUMD
Manufacturer # :B4860NXN7QUMD
Manufacturer :Rochester Electronics
Dasenic # :B4860NXN7QUMD-DS
Datasheet : B4860NXN7QUMD Datasheet
Customer # :
Description : BASEBAND PROC PILOT REV 1.0
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 1947
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 553.401
Total :$ 553.40
Delivery :
Payment :
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B4860NXN7QUMD information
Rochester Electronics B4860NXN7QUMD technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - Microprocessors
- Product Status:Active
- Operating Temperature:-40°C ~ 105°C (TA)
- Package / Case:1020-BBGA, FCBGA
- Supplier Device Package:1020-FCPBGA (33x33)
- Voltage - I/ O:1.0V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
- Speed:1.8GHz
- Core Processor:PowerPC e6500
- Number of Cores/ Bus Width:4 Core, 64-Bit
- Co- Processors/ D S P:Signal Processing; SC3900FP FVP - 6 Core
- R A M Controllers:DDR3, DDR3L
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:1/2.5Gbps (4), 1/2.5/10Gbps (2)
- S A T A:-
- U S B:USB 2.0 (1)
- Security Features:AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:5A002A1
- HTS US:8542.31.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
B4860NXN7QUMD provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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