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1 : $0.1350
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Rochester Electronics AT24C08BU3-UU-T
IC EEPROM 8KBIT I2C 1MHZ 8VFBGA
Manufacturer # :AT24C08BU3-UU-T
Manufacturer :Rochester Electronics
Dasenic # :AT24C08BU3-UU-T-DS
Datasheet :
AT24C08BU3-UU-T Datasheet
AT24C08BU3-UU-T DatasheetCustomer # :
Description : IC EEPROM 8KBIT I2C 1MHZ 8VFBGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 0.1350 | $ 0.14 |
In Stock: 29700
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.135
Total :$ 0.14
Delivery :
Payment :
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AT24C08BU3-UU-T information
Rochester Electronics AT24C08BU3-UU-T technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Memory Integrated Circuit
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Surface Mount
- Package / Case:8-VFBGA
- Technology:EEPROM
- Supplier Device Package:8-VFBGA (1.5x2)
- Memory Size:8Kb (1K x 8)
- Memory Type:Non-Volatile
- Voltage - Supply:1.8V ~ 5.5V
- Clock Frequency:1 MHz
- Access Time:550 ns
- Memory Format:EEPROM
- Memory Interface:I²C
- Write Cycle Time - Word, Page:5ms
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:Vendor omitted MSL Rating information
- US ECCN:EAR99
- HTS US:8542.32.0051
- China RoHS Status:Green Symbol: Green and environmentally friendly product
AT24C08BU3-UU-T provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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