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1 : $43.7850
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Rochester Electronics AM7200-25JC
FIFO, 256X9, 25NS, ASYNCHRONOUS,
Manufacturer # :AM7200-25JC
Manufacturer :Rochester Electronics
Dasenic # :AM7200-25JC-DS
Datasheet :
AM7200-25JC Datasheet
AM7200-25JC DatasheetCustomer # :
Description : FIFO, 256X9, 25NS, ASYNCHRONOUS,
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 43.7850 | $ 43.79 |
| 25+ | $ 42.9120 | $ 1072.8 |
| 100+ | $ 41.1570 | $ 4115.7 |
| 500+ | $ 39.4110 | $ 19705.5 |
| 1000+ | $ 37.2150 | $ 37215 |
In Stock: 4170
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 43.785
Total :$ 43.78
Delivery :
Payment :
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AM7200-25JC information
Rochester Electronics AM7200-25JC technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Logic - FIFOs Memory
- Product Status:Active
- Operating Temperature:-
- Mounting Type:-
- Package / Case:-
- Supplier Device Package:-
- Memory Size:-
- Voltage - Supply:-
- Current - Supply ( Max):-
- Data Rate:-
- Access Time:-
- Bus Directional:-
- Expansion Type:-
- Programmable Flags Support:-
- Retransmit Capability:-
- F W F T Support:-
- Function:-
- EU RoHS Status:RoHS Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH is not affected
- US ECCN:EAR99
- HTS US:8542.32.0071
- China RoHS Status:Green Symbol: Green and environmentally friendly product
AM7200-25JC provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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