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Rochester Electronics AM3715CUS100

IC MPU SITARA 1.0GHZ 423FCBGA
part number has RoHS
Manufacturer # :AM3715CUS100
Manufacturer :Rochester Electronics
Dasenic # :AM3715CUS100-DS
Customer # :
Description : IC MPU SITARA 1.0GHZ 423FCBGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
90+$ 72.1400$ 6492.6
In Stock: 2575
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 72.14
Total :$ 72.14
Delivery :
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Payment :
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AM3715CUS100 information

  • Rochester Electronics AM3715CUS100 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Microcontroller, Microprocessor, FPGA Modules
  • Product Status:Active
  • Operating Temperature:0°C ~ 90°C (TJ)
  • Package / Case:423-LFBGA, FCBGA
  • Supplier Device Package:423-FCBGA (16x16)
  • Voltage - I/ O:1.8V
  • Speed:1.0GHz
  • Core Processor:ARM® Cortex®-A8
  • Number of Cores/ Bus Width:1 Core, 32-Bit
  • Co- Processors/ D S P:Multimedia; NEON™ SIMD
  • R A M Controllers:SDRAM
  • Graphics Acceleration:Yes
  • Display & Interface Controllers:LCD
  • Ethernet:-
  • S A T A:-
  • U S B:USB 2.0 (4)
  • Security Features:-
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:5A992C
  • HTS US:8542.31.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
AM3715CUS100 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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