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Rochester Electronics AM3352ZCE27
Manufacturer # :AM3352ZCE27
Manufacturer :Rochester Electronics
Dasenic # :AM3352ZCE27-DS
Datasheet : AM3352ZCE27 Datasheet
Customer # :
Description : IC MPU SITARA 275MHZ 298NFBGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 3174
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 11.871
Total :$ 11.87
Delivery :
Payment :
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AM3352ZCE27 information
Rochester Electronics AM3352ZCE27 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Microcontroller, Microprocessor, FPGA Modules
- Product Status:Obsolete
- Operating Temperature:0°C ~ 90°C (TJ)
- Package / Case:298-LFBGA
- Supplier Device Package:298-NFBGA (13x13)
- Voltage - I/ O:1.8V, 3.3V
- Speed:275MHz
- Core Processor:ARM® Cortex®-A8
- Number of Cores/ Bus Width:1 Core, 32-Bit
- Co- Processors/ D S P:Multimedia; NEON™ SIMD
- R A M Controllers:LPDDR, DDR2, DDR3, DDR3L
- Graphics Acceleration:Yes
- Display & Interface Controllers:LCD, Touchscreen
- Ethernet:10/100/1000Mbps (2)
- S A T A:-
- U S B:USB 2.0 + PHY (2)
- Security Features:Cryptography, Random Number Generator
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:5A002A1 TI
- HTS US:8542.31.0001
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
AM3352ZCE27 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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