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Rochester Electronics AM27S281APC

AM27S281 - OTP ROM, 1KX8, 35NS
part number has RoHS
Manufacturer # :AM27S281APC
Manufacturer :Rochester Electronics
Dasenic # :AM27S281APC-DS
Customer # :
Description : AM27S281 - OTP ROM, 1KX8, 35NS
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 5.2380$ 5.24
25+$ 5.1300$ 128.25
100+$ 4.9230$ 492.3
500+$ 4.7160$ 2358
1000+$ 4.4550$ 4455
In Stock: 1712
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 5.238
Total :$ 5.24
Delivery :
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Payment :
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AM27S281APC information

  • Rochester Electronics AM27S281APC technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Memory Integrated Circuit
  • Product Status:Active
  • Operating Temperature:0°C ~ 75°C (TA)
  • Mounting Type:Through Hole
  • Package / Case:24-DIP (0.300", 7.62mm)
  • Technology:-
  • Supplier Device Package:24-PDIP
  • Memory Size:8Kb (1K x 8)
  • Memory Type:Non-Volatile
  • Voltage - Supply:4.75V ~ 5.25V
  • Clock Frequency:-
  • Access Time:35 ns
  • Memory Format:PROM
  • Memory Interface:Parallel
  • Write Cycle Time - Word, Page:-
  • EU RoHS Status:RoHS non-compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:Vendor omitted MSL Rating information
  • US ECCN:EAR99
  • HTS US:8542.32.0071
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
AM27S281APC provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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