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Rochester Electronics AGXD500EEXE0BC

MICROPROCESSOR, GEODE, X86 ARCH
part number has RoHS
Manufacturer # :AGXD500EEXE0BC
Manufacturer :Rochester Electronics
Dasenic # :AGXD500EEXE0BC-DS
Customer # :
Description : MICROPROCESSOR, GEODE, X86 ARCH
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 25.0020$ 25
25+$ 24.4980$ 612.45
100+$ 23.4990$ 2349.9
500+$ 22.5000$ 11250
1000+$ 21.2490$ 21249
In Stock: 27314
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 25.002
Total :$ 25.00
Delivery :
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Payment :
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AGXD500EEXE0BC information

  • Rochester Electronics AGXD500EEXE0BC technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Embedded - Microprocessors
  • Product Status:Active
  • Operating Temperature:0°C ~ 85°C (TC)
  • Package / Case:396-BBGA
  • Supplier Device Package:396-TEPBGA (35x35)
  • Voltage - I/ O:3.3V
  • Speed:366MHz
  • Core Processor:AMD Geode™ GX
  • Number of Cores/ Bus Width:1 Core
  • Co- Processors/ D S P:-
  • R A M Controllers:DDR
  • Graphics Acceleration:Yes
  • Display & Interface Controllers:TFT, VGA
  • Ethernet:-
  • S A T A:-
  • U S B:-
  • Security Features:-
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
AGXD500EEXE0BC provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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