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Rochester Electronics ADUM7223BCCZ
Manufacturer # :ADUM7223BCCZ
Manufacturer :Rochester Electronics
Dasenic # :ADUM7223BCCZ-DS
Datasheet : ADUM7223BCCZ Datasheet
Customer # :
Description : DGTL ISO 2.5KV GATE DRIVER 13LGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 9471
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 5.373
Total :$ 5.37
Delivery :
Payment :
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ADUM7223BCCZ information
Rochester Electronics ADUM7223BCCZ technical specifications, attributes, parameters.
- Category:Isolators/Isolator Gate Drivers
- Product Status:Active
- Operating Temperature:-40°C ~ 125°C
- Mounting Type:Surface Mount
- Package / Case:13-VFLGA
- Technology:Magnetic Coupling
- Approval Agency:-
- Number of Channels:2
- Supplier Device Package:13-LGA (5x5)
- Current - Output High, Low:-
- Voltage - Isolation:2500Vrms
- Current - Peak Output:4A
- Rise / Fall Time ( Typ):12ns, 12ns
- Common Mode Transient Immunity ( Min):50kV/µs
- Propagation Delay tp L H / tp H L ( Max):62ns, 62ns
- Pulse Width Distortion ( Max):-
- Voltage - Forward ( Vf) ( Typ):-
- Current - D C Forward ( If) ( Max):-
- Voltage - Output Supply:4.5V ~ 18V
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8543.70.9860
- China RoHS Status:Green Symbol: Green and environmentally friendly product
ADUM7223BCCZ provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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