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Rochester Electronics ADUM1311ARWZ
Manufacturer # :ADUM1311ARWZ
Manufacturer :Rochester Electronics
Dasenic # :ADUM1311ARWZ-DS
Datasheet : ADUM1311ARWZ Datasheet
Customer # :
Description : DGTL ISO 3750VRMS 3CH GP 16SOIC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 12912
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.395
Total :$ 1.40
Delivery :
Payment :
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ADUM1311ARWZ information
Rochester Electronics ADUM1311ARWZ technical specifications, attributes, parameters.
- Category:Isolators/Digital Isolators
- Product Status:Active
- Operating Temperature:-40°C ~ 105°C
- Mounting Type:Surface Mount
- Package / Case:16-SOIC (0.295", 7.50mm Width)
- Technology:Magnetic Coupling
- Type:General Purpose
- Number of Channels:3
- Supplier Device Package:16-SOIC
- Voltage - Supply:2.7V ~ 5.5V
- Data Rate:1Mbps
- Channel Type:Unidirectional
- Voltage - Isolation:3750Vrms
- Rise / Fall Time ( Typ):2.5ns, 2.5ns
- Isolated Power:No
- Inputs - Side 1/ Side 2:2/1
- Common Mode Transient Immunity ( Min):25kV/µs
- Propagation Delay tp L H / tp H L ( Max):100ns, 100ns
- Pulse Width Distortion ( Max):40ns
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
ADUM1311ARWZ provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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