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Rochester Electronics ADUM1301WTRWZ53
Manufacturer # :ADUM1301WTRWZ53
Manufacturer :Rochester Electronics
Dasenic # :ADUM1301WTRWZ53-DS
Datasheet : ADUM1301WTRWZ53 Datasheet
Customer # :
Description : IC DGTL ISO 3CH LOGIC 16SOIC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 22
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.17
Total :$ 1.17
Delivery :
Payment :
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ADUM1301WTRWZ53 information
Rochester Electronics ADUM1301WTRWZ53 technical specifications, attributes, parameters.
- Category:Isolators/Digital Isolators
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 125°C
- Mounting Type:Surface Mount
- Package / Case:16-SOIC (0.295", 7.50mm Width)
- Technology:Magnetic Coupling
- Type:General Purpose
- Number of Channels:3
- Supplier Device Package:16-SOIC
- Voltage - Supply:3V ~ 5.5V
- Data Rate:10Mbps
- Channel Type:Unidirectional
- Voltage - Isolation:2500Vrms
- Rise / Fall Time ( Typ):2.5ns, 2.5ns
- Isolated Power:No
- Inputs - Side 1/ Side 2:2/1
- Common Mode Transient Immunity ( Min):25kV/µs
- Propagation Delay tp L H / tp H L ( Max):32ns, 32ns
- Pulse Width Distortion ( Max):3ns
- MSL Rating:3 (168 Hours,30°C/60%RH)
- US ECCN:EAR99
- HTS US:8542.39.0001
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
ADUM1301WTRWZ53 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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