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Rochester Electronics ADUC847BCPZ62-3
Manufacturer # :ADUC847BCPZ62-3
Manufacturer :Rochester Electronics
Dasenic # :ADUC847BCPZ62-3-DS
Datasheet : ADUC847BCPZ62-3 Datasheet
Customer # :
Description : IC MCU 8BIT 62KB FLASH 56LFCSP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 1809
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 28.602
Total :$ 28.60
Delivery :
Payment :
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ADUC847BCPZ62-3 information
Rochester Electronics ADUC847BCPZ62-3 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - Microcontrollers
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Surface Mount
- Package / Case:56-VFQFN Exposed Pad, CSP
- Supplier Device Package:56-LFCSP-VQ (8x8)
- Peripherals:POR, PSM, PWM, Temp Sensor, WDT
- Number of I/ O:34
- Speed:12.58MHz
- E E P R O M Size:4K x 8
- Core Processor:8052
- R A M Size:2.25K x 8
- Program Memory Type:Flash
- Core Size:8-Bit
- Connectivity:I²C, SPI, UART/USART
- Program Memory Size:62KB (62K x 8)
- Voltage - Supply ( Vcc/ Vdd):2.7V ~ 3.6V
- Data Converters:A/D 10x24b; D/A 1x12b, 2x16b
- Oscillator Type:Internal
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.31.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
ADUC847BCPZ62-3 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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