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Rochester Electronics ADUC7039WBCPZ
Manufacturer # :ADUC7039WBCPZ
Manufacturer :Rochester Electronics
Dasenic # :ADUC7039WBCPZ-DS
Datasheet : ADUC7039WBCPZ Datasheet
Customer # :
Description : IC MCU 16/32B 64KB FLASH 32LFCSP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 1743
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 5.454
Total :$ 5.45
Delivery :
Payment :
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ADUC7039WBCPZ information
Rochester Electronics ADUC7039WBCPZ technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Microcontroller, Microprocessor, FPGA Modules
- Product Status:Active
- Operating Temperature:-40°C ~ 115°C (TA)
- Mounting Type:Surface Mount
- Package / Case:32-VFQFN Exposed Pad, CSP
- Supplier Device Package:32-LFCSP-VQ (6x6)
- Peripherals:POR, Temp Sensor, WDT
- Number of I/ O:6
- Speed:20.48MHz
- E E P R O M Size:-
- Core Processor:ARM7®
- R A M Size:1K x 32
- Program Memory Type:Flash
- Core Size:16/32-Bit
- Connectivity:LINbus, SPI
- Program Memory Size:64KB (32K x 16)
- Voltage - Supply ( Vcc/ Vdd):3.5V ~ 18V
- Data Converters:A/D 2x16b
- Oscillator Type:Internal
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.31.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
ADUC7039WBCPZ provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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