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Rochester Electronics ADUC7039BCP6Z
Manufacturer # :ADUC7039BCP6Z
Manufacturer :Rochester Electronics
Dasenic # :ADUC7039BCP6Z-DS
Datasheet : ADUC7039BCP6Z Datasheet
Customer # :
Description : IC MCU 16/32B 64KB FLASH 32LFCSP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 11400
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 5.454
Total :$ 5.45
Delivery :
Payment :
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ADUC7039BCP6Z information
Rochester Electronics ADUC7039BCP6Z technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Microcontroller, Microprocessor, FPGA Modules
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 115°C (TA)
- Mounting Type:Surface Mount
- Package / Case:32-VFQFN Exposed Pad, CSP
- Supplier Device Package:32-LFCSP-VQ (6x6)
- Peripherals:POR, Temp Sensor, WDT
- Number of I/ O:6
- Speed:20.48MHz
- E E P R O M Size:-
- Core Processor:ARM7®
- R A M Size:1K x 32
- Program Memory Type:Flash
- Core Size:16/32-Bit
- Connectivity:LINbus, SPI
- Program Memory Size:64KB (32K x 16)
- Voltage - Supply ( Vcc/ Vdd):3.5V ~ 18V
- Data Converters:A/D 2x16b
- Oscillator Type:Internal
- MSL Rating:3 (168 Hours,30°C/60%RH)
- US ECCN:EAR99
- HTS US:8542.31.0001
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
ADUC7039BCP6Z provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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