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Rochester Electronics ADSP-TS203SABP-050

IC DSP FLOAT/FIXED 500MHZ 576BGA
part number has RoHS
Manufacturer # :ADSP-TS203SABP-050
Manufacturer :Rochester Electronics
Dasenic # :ADSP-TS203SABP-050-DS
Customer # :
Description : IC DSP FLOAT/FIXED 500MHZ 576BGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 35.1000$ 35.1
10+$ 33.3450$ 333.45
100+$ 31.5900$ 3159
1000+$ 28.0800$ 28080
10000+$ 26.3250$ 263250
In Stock: 46850
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 35.1
Total :$ 35.10
Delivery :
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Payment :
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ADSP-TS203SABP-050 information

  • Rochester Electronics ADSP-TS203SABP-050 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Embedded - DSP (Digital Signal Processors)
  • Product Status:Obsolete
  • Operating Temperature:-40°C ~ 85°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:576-BBGA
  • Type:Fixed/Floating Point
  • Interface:Host Interface, Link Port, Multi-Processor
  • Supplier Device Package:576-BGA-ED (25x25)
  • Clock Rate:500MHz
  • Non- Volatile Memory:External
  • On- Chip R A M:512KB
  • Voltage - I/ O:2.50V
  • Voltage - Core:1.05V
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
ADSP-TS203SABP-050 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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