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Rochester Electronics ADSP-TS101SAB2Z100
IC DSP CTRLR 6MBIT 300MHZ 484BGA
Manufacturer # :ADSP-TS101SAB2Z100
Manufacturer :Rochester Electronics
Dasenic # :ADSP-TS101SAB2Z100-DS
Datasheet :
ADSP-TS101SAB2Z100 Datasheet
ADSP-TS101SAB2Z100 DatasheetCustomer # :
Description : IC DSP CTRLR 6MBIT 300MHZ 484BGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 4.7579 | $ 4.76 |
| 100+ | $ 4.1394 | $ 413.94 |
| 1000+ | $ 3.7112 | $ 3711.2 |
In Stock: 49770
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 4.7579
Total :$ 4.76
Delivery :
Payment :
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ADSP-TS101SAB2Z100 information
Rochester Electronics ADSP-TS101SAB2Z100 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - DSP (Digital Signal Processors)
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C (TC)
- Mounting Type:Surface Mount
- Package / Case:484-BFBGA
- Type:Fixed/Floating Point
- Interface:Host Interface, Link Port, Multi-Processor
- Supplier Device Package:484-PBGA (19x19)
- Clock Rate:300MHz
- Non- Volatile Memory:External
- On- Chip R A M:768kB
- Voltage - I/ O:3.30V
- Voltage - Core:1.20V
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Green Symbol: Green and environmentally friendly product
ADSP-TS101SAB2Z100 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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