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Rochester Electronics ADSP-CM402CSWZ-FF
IC ARM CORTEX M4 FLASH 120LQFP
Manufacturer # :ADSP-CM402CSWZ-FF
Manufacturer :Rochester Electronics
Dasenic # :ADSP-CM402CSWZ-FF-DS
Datasheet :
ADSP-CM402CSWZ-FF Datasheet
ADSP-CM402CSWZ-FF DatasheetCustomer # :
Description : IC ARM CORTEX M4 FLASH 120LQFP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 18.4642 | $ 18.46 |
| 100+ | $ 16.0638 | $ 1606.38 |
| 1000+ | $ 14.4021 | $ 14402.1 |
In Stock: 7274
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 18.4642
Total :$ 18.46
Delivery :
Payment :
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ADSP-CM402CSWZ-FF information
Rochester Electronics ADSP-CM402CSWZ-FF technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - DSP (Digital Signal Processors)
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 105°C (TA)
- Mounting Type:Surface Mount
- Package / Case:120-LQFP Exposed Pad
- Type:Floating Point
- Interface:CAN, I²C, SPI, SPORT, UART/USART
- Supplier Device Package:120-LQFP-EP (14x14)
- Clock Rate:100MHz
- Non- Volatile Memory:FLASH (256kB)
- On- Chip R A M:128KB
- Voltage - I/ O:3.30V
- Voltage - Core:1.20V
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Green Symbol: Green and environmentally friendly product
ADSP-CM402CSWZ-FF provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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