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1 : $1.1286
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Rochester Electronics ADSP-BF533SBBZ400
IC DSP CTLR 16BIT 400MHZ 169-BGA
Manufacturer # :ADSP-BF533SBBZ400
Manufacturer :Rochester Electronics
Dasenic # :ADSP-BF533SBBZ400-DS
Datasheet :
ADSP-BF533SBBZ400 Datasheet
ADSP-BF533SBBZ400 DatasheetCustomer # :
Description : IC DSP CTLR 16BIT 400MHZ 169-BGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 1.1286 | $ 1.13 |
| 100+ | $ 0.9819 | $ 98.19 |
| 1000+ | $ 0.8803 | $ 880.3 |
In Stock: 39944
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.1286
Total :$ 1.13
Delivery :
Payment :
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ADSP-BF533SBBZ400 information
Rochester Electronics ADSP-BF533SBBZ400 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - DSP (Digital Signal Processors)
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Surface Mount
- Package / Case:169-BBGA
- Type:Fixed Point
- Interface:SPI, SSP, UART
- Supplier Device Package:169-PBGA (19x19)
- Clock Rate:400MHz
- Non- Volatile Memory:ROM (1kB)
- On- Chip R A M:148kB
- Voltage - I/ O:3.30V
- Voltage - Core:1.20V
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:3A991A2
- HTS US:8542.31.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
ADSP-BF533SBBZ400 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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