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Rochester Electronics ADSP-BF526BBCZ-3A

EMBEDDED PROCESSOR, BLACKFIN
part number has RoHS
Manufacturer # :ADSP-BF526BBCZ-3A
Manufacturer :Rochester Electronics
Dasenic # :ADSP-BF526BBCZ-3A-DS
Customer # :
Description : EMBEDDED PROCESSOR, BLACKFIN
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 29.4840$ 29.48
10+$ 22.1310$ 221.31
25+$ 20.2496$ 506.24
1000+$ 13.9590$ 13959
In Stock: 4152
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 29.484
Total :$ 29.48
Delivery :
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Payment :
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ADSP-BF526BBCZ-3A information

  • Rochester Electronics ADSP-BF526BBCZ-3A technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Embedded - DSP (Digital Signal Processors)
  • Product Status:Active
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:208-FBGA, CSPBGA
  • Type:Fixed Point
  • Interface:DMA, Ethernet, I²C, PPI, SPI, SPORT, UART, USB
  • Supplier Device Package:208-CSPBGA (17x17)
  • Clock Rate:300MHz
  • Non- Volatile Memory:ROM (32kB)
  • On- Chip R A M:132kB
  • Voltage - I/ O:1.8V, 2.5V, 3.3V
  • Voltage - Core:1.30V
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
ADSP-BF526BBCZ-3A provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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