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Rochester Electronics ADSP-BF516BBCZ-3

IC DSP 16/32B 300MHZ 168CSBGA
part number has RoHS
Manufacturer # :ADSP-BF516BBCZ-3
Manufacturer :Rochester Electronics
Dasenic # :ADSP-BF516BBCZ-3-DS
Customer # :
Description : IC DSP 16/32B 300MHZ 168CSBGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 26.2260$ 26.23
10+$ 19.5417$ 195.42
25+$ 17.8283$ 445.71
1000+$ 12.0780$ 12078
In Stock: 4299
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 26.226
Total :$ 26.23
Delivery :
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Payment :
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ADSP-BF516BBCZ-3 information

  • Rochester Electronics ADSP-BF516BBCZ-3 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Embedded - DSP (Digital Signal Processors)
  • Product Status:Active
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:168-LFBGA, CSPBGA
  • Type:Fixed Point
  • Interface:Ethernet, I²C, PPI, RSI, SPI, SPORT, UART/USART
  • Supplier Device Package:168-CSPBGA (12x12)
  • Clock Rate:300MHz
  • Non- Volatile Memory:External
  • On- Chip R A M:116kB
  • Voltage - I/ O:1.8V, 2.5V, 3.3V
  • Voltage - Core:1.30V
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:3A991A2
  • HTS US:8542.31.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
ADSP-BF516BBCZ-3 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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