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Rochester Electronics ADSP-21MSP50AKG-52

MIXED-SIGNAL PROCESSOR
part number has RoHS
Manufacturer # :ADSP-21MSP50AKG-52
Manufacturer :Rochester Electronics
Dasenic # :ADSP-21MSP50AKG-52-DS
Customer # :
Description : MIXED-SIGNAL PROCESSOR
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 48.7530$ 48.75
25+$ 47.7810$ 1194.53
100+$ 45.8280$ 4582.8
500+$ 43.8750$ 21937.5
1000+$ 41.4360$ 41436
In Stock: 1558
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 48.753
Total :$ 48.75
Delivery :
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Payment :
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ADSP-21MSP50AKG-52 information

  • Rochester Electronics ADSP-21MSP50AKG-52 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Embedded - DSP (Digital Signal Processors)
  • Product Status:Active
  • Operating Temperature:0°C ~ 70°C (TA)
  • Mounting Type:Through Hole
  • Package / Case:144-CPGA
  • Type:Mixed Signal Processors
  • Interface:Host Interface, Serial Port
  • Supplier Device Package:144-PGA
  • Clock Rate:13MHz
  • Non- Volatile Memory:ROM (2kB)
  • On- Chip R A M:2KB
  • Voltage - I/ O:5.00V
  • Voltage - Core:5.00V
  • EU RoHS Status:RoHS non-compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH Affected
  • US ECCN:EAR99
  • HTS US:8542.31.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
ADSP-21MSP50AKG-52 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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