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Rochester Electronics ADSP-2183KCAZ-210

IC DSP 16BIT 52MHZ 144-BGA
part number has RoHS
Manufacturer # :ADSP-2183KCAZ-210
Manufacturer :Rochester Electronics
Dasenic # :ADSP-2183KCAZ-210-DS
Customer # :
Description : IC DSP 16BIT 52MHZ 144-BGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 52.0380$ 52.04
25+$ 50.9940$ 1274.85
100+$ 48.9150$ 4891.5
500+$ 46.8360$ 23418
1000+$ 44.2350$ 44235
In Stock: 3375
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 52.038
Total :$ 52.04
Delivery :
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ADSP-2183KCAZ-210 information

  • Rochester Electronics ADSP-2183KCAZ-210 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Embedded - DSP (Digital Signal Processors)
  • Product Status:Obsolete
  • Operating Temperature:0°C ~ 70°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:144-LFBGA
  • Type:Fixed Point
  • Interface:Synchronous Serial Port (SSP)
  • Supplier Device Package:144-MiniBGA (10x10)
  • Clock Rate:52MHz
  • Non- Volatile Memory:External
  • On- Chip R A M:80kB
  • Voltage - I/ O:3.30V
  • Voltage - Core:3.30V
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • US ECCN:3A991A2
  • HTS US:8542.31.0001
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
ADSP-2183KCAZ-210 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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