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Rochester Electronics ADSP-2181BSZ-133

IC DSP CONTROLLER 16BIT 128QFP
part number has RoHS
Manufacturer # :ADSP-2181BSZ-133
Manufacturer :Rochester Electronics
Dasenic # :ADSP-2181BSZ-133-DS
Customer # :
Description : IC DSP CONTROLLER 16BIT 128QFP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
2+$ 41.9679$ 83.94
3+$ 34.4349$ 103.3
5+$ 33.3594$ 166.8
6+$ 32.2830$ 193.7
8+$ 31.2066$ 249.65
In Stock: 6000
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 41.9679
Total :$ 41.97
Delivery :
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Payment :
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ADSP-2181BSZ-133 information

  • Rochester Electronics ADSP-2181BSZ-133 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Embedded - DSP (Digital Signal Processors)
  • Product Status:Active
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:128-BQFP
  • Type:Fixed Point
  • Interface:Synchronous Serial Port (SSP)
  • Supplier Device Package:128-PQFP (28x28)
  • Clock Rate:33.3MHz
  • Non- Volatile Memory:External
  • On- Chip R A M:80kB
  • Voltage - I/ O:5.00V
  • Voltage - Core:5.00V
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:3A991A2
  • HTS US:8542.31.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
ADSP-2181BSZ-133 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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