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1 : $31.8060
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Rochester Electronics ADSP-21375BSWZ-2B
IC DSP 32BIT 266MHZ 208-MQFP
Manufacturer # :ADSP-21375BSWZ-2B
Manufacturer :Rochester Electronics
Dasenic # :ADSP-21375BSWZ-2B-DS
Datasheet :
ADSP-21375BSWZ-2B Datasheet
ADSP-21375BSWZ-2B DatasheetCustomer # :
Description : IC DSP 32BIT 266MHZ 208-MQFP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 31.8060 | $ 31.81 |
| 10+ | $ 23.9913 | $ 239.91 |
| 25+ | $ 21.9924 | $ 549.81 |
| 1000+ | $ 15.3270 | $ 15327 |
In Stock: 5118
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 31.806
Total :$ 31.81
Delivery :
Payment :
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ADSP-21375BSWZ-2B information
Rochester Electronics ADSP-21375BSWZ-2B technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - DSP (Digital Signal Processors)
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Surface Mount
- Package / Case:208-LQFP Exposed Pad
- Type:Floating Point
- Interface:DAI, DPI
- Supplier Device Package:208-LQFP-EP (28x28)
- Clock Rate:266MHz
- Non- Volatile Memory:ROM (256kB)
- On- Chip R A M:64kB
- Voltage - I/ O:3.30V
- Voltage - Core:1.20V
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Green Symbol: Green and environmentally friendly product
ADSP-21375BSWZ-2B provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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